LATEST HEADLINES
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Teledyne HiRel Semiconductors Releases Wideband 50 GHz RF Switch2/4/2025
Teledyne HiRel Semiconductors announces the availability of its latest rad-tolerant wideband 50 GHz RF switch, model TDSW050A2T.
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3M Joins Consortium To Accelerate Semiconductor Technology In The US2/3/2025
3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers.
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Teradyne And Infineon Announce Strategic Partnership To Advance Power Testing1/31/2025
Teradyne, Inc. a leading supplier of automated test solutions, and Infineon Technologies AG , a global semiconductor leader in power systems and IoT, today announced they have entered into a strategic partnership to advance power semiconductor test.
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OKI Achieves 3D Integration Of Thin-Film Analog ICs Using CFB Technology In Collaboration With Nisshinbo Micro Devices1/28/2025
OKI, in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) integration (Note 1) of thin-film analog ICs (Note 2) using Crystal Film Bonding (CFB) technology (Note 3).
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TANAKA PRECIOUS METAL TECHNOLOGIES Develops AgSn TLP Sheet, A Sheet-Type Bonding Material For Power Semiconductors1/23/2025
TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. , which engages in the industrial precious metals business of TANAKA, has announced the development of the AgSn TLP sheet, a sheet-type bonding material designed for die attachment in the manufacturing of power semiconductor packages.
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